Semiconductor device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S618000, C257S757000, C257S768000, C257S773000

Reexamination Certificate

active

07414291

ABSTRACT:
A method includes the steps of: implanting boron into a surface region of a silicon substrate to form a p+diffused region; implanting indium into the surface of the p+diffused region, to form an indium-implanted layer; forming a contact metal layer on the indium-implanted layer; and reacting silicon in the silicon substrate including the indium-implanted layer with metal in the contact metal layer to form a titanium silicide layer.

REFERENCES:
patent: 6963097 (2005-11-01), Kweon
patent: 2003/0207569 (2003-11-01), Gerritsen et al.
patent: 2004/0079997 (2004-04-01), Miura
patent: 2005/0280118 (2005-12-01), Lin et al.
patent: 1-233726 (1989-09-01), None
patent: 01-233726 (1989-09-01), None
patent: 10-242077 (1998-09-01), None
patent: 11-145078 (1999-05-01), None
patent: 11-297637 (1999-10-01), None
patent: 2001-65303 (2001-07-01), None
patent: 2003-52236 (2003-06-01), None

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