Semiconductor device and method of manufacturing the same,...

Details Semiconductor device and method of manufacturing the same,... Semiconductor device and method of manufacturing the same,...

2008-01-01

2008-01-01

Pham, Hoai v (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S617000, C438S666000, C257SE21508

Reexamination Certificate

active

11410129

ABSTRACT:
A tip of a first wire is bonded to a first electrode. The first wire is drawn from the first electrode to a bump on a second electrode. A part of the first wire is deformed and bonded to the bump. A tip of a second wire formed in the shape of a ball is bonded to the bump by using a tool in a state in which at least a part of the tip is superposed on the first wire. A part of the first wire which is not deformed by bonding is prevented from being deformed by the tip of the second wire and the tool.

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