Semiconductor device and method of manufacturing the same,...

Details Semiconductor device and method of manufacturing the same,... Semiconductor device and method of manufacturing the same,...

2007-06-26

2007-06-26

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S723000, C257S693000, C257S668000, C257S776000, C257SE23169, C257SE23178, C438S067000, C438S107000, C438S109000

Reexamination Certificate

active

10968851

ABSTRACT:
A semiconductor device includes a wiring board having a wiring pattern, a semiconductor chip that has an integrated circuit and is mounted on a first surface of the wiring board to electrically connect with the wiring pattern, a spacer that is disposed on a second surface of the wiring board and has inside thereof an electronic component that is electrically connected with the wiring pattern and an external terminal that is disposed on the second surface and electrically connected with the wiring pattern.

REFERENCES:
patent: 6525414 (2003-02-01), Shiraishi et al.
patent: 6611063 (2003-08-01), Ichinose et al.
patent: 6617695 (2003-09-01), Kasatani
patent: 6774473 (2004-08-01), Shen
patent: 10-084011 (1998-03-01), None
patent: 2001-102512 (2001-04-01), None
patent: 2001-223297 (2001-08-01), None

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