Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-02-27
2007-02-27
Prenty, Mark V. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S773000
Reexamination Certificate
active
10916917
ABSTRACT:
A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.
REFERENCES:
patent: 6467674 (2002-10-01), Mihara
patent: 6486005 (2002-11-01), Kim
patent: 6657295 (2003-12-01), Araki
patent: 6749927 (2004-06-01), Cooray
patent: 6882054 (2005-04-01), Jobetto
patent: 2002/0038890 (2002-04-01), Ohuchi
patent: 2005/0051886 (2005-03-01), Mihara et al.
patent: 2005/0146051 (2005-07-01), Jobetto
patent: 11-233678 (1999-08-01), None
patent: 2001-326299 (2001-11-01), None
patent: 2001-332643 (2001-11-01), None
patent: 2002-016173 (2002-01-01), None
patent: 2002-084074 (2002-03-01), None
patent: 2002-231854 (2002-08-01), None
patent: 2002-246755 (2002-08-01), None
patent: 2002-246756 (2002-08-01), None
Jobetto Hiroyasu
Kageyama Nobuyuki
Kido Toshihiro
Kohno Daita
Mihara Ichiro
Casio Computer Co. Ltd.
CMK Corporation
Frishauf Holtz Goodman & Chick P.C.
Prenty Mark V.
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