Semiconductor device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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C257S773000

Reexamination Certificate

active

10916917

ABSTRACT:
A semiconductor device includes at least one semiconductor structure which has a plurality of external connection electrodes formed on a semiconductor substrate. An insulating sheet member is arranged on the side of the semiconductor structure. Upper interconnections have connection pad portions that are arranged on the insulating sheet member in correspondence with the upper interconnections and connected to the external connection electrodes of the semiconductor structure.

REFERENCES:
patent: 6467674 (2002-10-01), Mihara
patent: 6486005 (2002-11-01), Kim
patent: 6657295 (2003-12-01), Araki
patent: 6749927 (2004-06-01), Cooray
patent: 6882054 (2005-04-01), Jobetto
patent: 2002/0038890 (2002-04-01), Ohuchi
patent: 2005/0051886 (2005-03-01), Mihara et al.
patent: 2005/0146051 (2005-07-01), Jobetto
patent: 11-233678 (1999-08-01), None
patent: 2001-326299 (2001-11-01), None
patent: 2001-332643 (2001-11-01), None
patent: 2002-016173 (2002-01-01), None
patent: 2002-084074 (2002-03-01), None
patent: 2002-231854 (2002-08-01), None
patent: 2002-246755 (2002-08-01), None
patent: 2002-246756 (2002-08-01), None

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