Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

2007-07-24

2007-07-24

Potter, Roy Karl (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S723000, C438S123000

Reexamination Certificate

active

10981557

ABSTRACT:
A semiconductor device comprises a frame provided on a substrate to form a semiconductor-chip accommodating part on the substrate. A semiconductor chip is provided in the semiconductor-chip accommodating part. An organic insulating layer is provided to cover the semiconductor chip and the frame. A wiring layer is provided on the organic insulating layer. In the semiconductor device, the frame comprises gaps which are arranged in a longitudinal direction of the frame.

REFERENCES:
patent: 2001-217381 (2001-08-01), None
patent: 2004-56093 (2004-02-01), None

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