Semiconductor device and method of manufacturing the same,...

Details Semiconductor device and method of manufacturing the same,... Semiconductor device and method of manufacturing the same,...

2006-10-10

2006-10-10

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S668000, C257S672000, C257S692000, C257S694000, C257S696000, C257S734000, C257S780000, C257S781000, C257S784000, C257SE23066, C257SE23042, C257SE23060, C257S926000, C257S673000, C257S674000

Reexamination Certificate

active

07119423

ABSTRACT:
A semiconductor chip is mounted on the substrate so that the first group of electrodes faces the first group of leads and the second group of electrodes faces the second group of leads. The first group of leads extends in a direction away from the second group of electrodes. Each of the second group of leads extends so as to pass between the first group of electrodes and is formed to be bent in the region between first and second straight lines.

REFERENCES:
patent: 6867490 (2005-03-01), Toyosawa
patent: A 07-235564 (1995-09-01), None
patent: A 07-273119 (1995-10-01), None
patent: A-2004-193223 (2004-07-01), None
U.S. Appl. No. 10/996,471, filed Nov. 26, 2004, Urushido.
U.S. Appl. No. 10/996,472, filed Nov. 26, 2004, Urushido.

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