Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-05-02
2006-05-02
Andujar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S648000, C257S720000, C438S122000
Reexamination Certificate
active
07038313
ABSTRACT:
A semiconductor device includes a circuit board formed of an insulator substrate and having conductor patterns on both surfaces thereof, a semiconductor chip bonded to the circuit board with one of the conductor patterns therebetween, and a radiator base bonded to the circuit board with a solder layer through the other of the conductor patterns therebetween for conducting heat generated in the semiconductor chip to an outside device. The radiator base is formed of a material having anisotropic thermal conductivity so that the radiator base has thermal conductivity in a direction perpendicular to a bonding plane between the radiator base and the circuit board higher than that along the bonding plane. The radiator base has thermal expansion coefficient along a bonding plane with the circuit board different from that along the bonding plate of the insulator substrate by a predetermined value.
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Mochizuki Eiji
Nishimura Yoshitaka
Andujar Leonardo
Fuji Electric Device Technology Co. Ltd.
Kanesaka Manabu
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