Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

1997-11-10

1999-11-23

Picardat, Kevin M.

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

438113, 438460, 438464, H01L 21301

Patent

active

059899824

ABSTRACT:
Disclosed herein is a method of manufacturing a semiconductor device, according to the present invention, wherein a wafer is divided into individual fractions by a diamond blade, the entire surface of the wafer, which include gaps between the respective fractions, is thereafter sealed with a resin, and the wafer is divided into individual fractions again by a diamond blade narrower than another diamond blade in width, whereby a chip size package in which the resin is being left on one sides of a chip, can be obtained. According to the method referred to above, a chip size package in which chip sides are also sealed with the resin, can be easily manufactured.

REFERENCES:
patent: 5547906 (1996-08-01), Badehi
patent: 5604160 (1997-02-01), Warfield
patent: 5776798 (1998-07-01), Quan et al.
patent: 5879964 (1999-03-01), Pair et al.
patent: 5897337 (1999-04-01), Kata et al.

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