Semiconductor device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

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Details

C257S773000, C257S510000, C257S698000

Reexamination Certificate

active

07397128

ABSTRACT:
Disclosed is a semiconductor device in which emitter pad electrodes connected to an active region, collector and base pad electrodes are formed on a surface of a semiconductor substrate. Furthermore, on a back surface of the semiconductor substrate, a backside electrode is formed. Moreover, the emitter pad electrodes connected to a grounding potential are connected to the backside electrode through feedthrough electrodes penetrating the semiconductor substrate in a thickness direction.

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patent: 2006/0231936 (2006-10-01), Matsuda
patent: 2004-102345 (2004-04-01), None
Drury, Bill. Control Techniques Drives and Controls Handbook. London, UK: The Institution of Electrical Engineers, 2001.

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