Semiconductor device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21704, C257SE27112, C438S151000

Reexamination Certificate

active

07986000

ABSTRACT:
A semiconductor device is formed on a SOI substrate having a semiconductor substrate, a buried oxide film formed on the semiconductor substrate, and a semiconductor layer formed on the buried oxide film, the semiconductor substrate having a first conductive type, the semiconductor layer having a second conductive type, wherein the buried oxide film has a first opening opened therethrough for communicating the semiconductor substrate with the semiconductor layer, the semiconductor layer is arranged to have a first buried portion buried in the first opening in contact with the semiconductor substrate and a semiconductor layer main portion positioned on the first buried portion and on the buried oxide film, the semiconductor substrate has a connection layer buried in a surface of the semiconductor substrate and electrically connected to the first buried portion in the first opening, the connection layer having the second conductive type, and the semiconductor device includes a contact electrode buried in a second opening, a side surface of the contact electrode being connected to the semiconductor layer main portion, a bottom surface of the contact electrode being connected to the connection layer, the second opening passing through the semiconductor layer main portion and the buried oxide film, and the second opening reaching a surface portion of the connection layer.

REFERENCES:
patent: 6838360 (2005-01-01), Kumazaki
patent: 7432561 (2008-10-01), Mizukami et al.
patent: 7442978 (2008-10-01), Yaegashi
patent: 7459748 (2008-12-01), Shirota et al.
patent: 7553728 (2009-06-01), Mizukami et al.
patent: 7781275 (2010-08-01), Yang
patent: 2006/0049449 (2006-03-01), Iino et al.
patent: 2008/0128780 (2008-06-01), Nishihara et al.
patent: 2008/0157092 (2008-07-01), Arai et al.
patent: 2008/0169497 (2008-07-01), Iino et al.
patent: 2008/0315280 (2008-12-01), Watanabe et al.
patent: 2006-73939 (2006-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2737850

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.