Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2011-06-07
2011-06-07
Booth, Richard A. (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257SE23191
Reexamination Certificate
active
07956467
ABSTRACT:
A method includes burying a conductive pattern in an insulating film made of SiOH, SiCOH or organic polymer, treating surfaces of the insulating film and the conductive pattern with plasma which includes a hydrocarbon gas as a treatment gas, and forming a diffusion barrier film, which is formed of an SiCH film, an SiCHN film, an SiCHO film or an SiCHON film, over the insulating film and the conductive pattern with performing a plasma CVD by adding an Si-containing gas to the treatment gas while increasing an addition amount gradually or in a step by step manner.
REFERENCES:
patent: 2004/0076767 (2004-04-01), Satoh et al.
patent: 2004/0115876 (2004-06-01), Goundar et al.
patent: 2002-203899 (2002-07-01), None
Booth Richard A.
McGinn IP Law Group PLLC
Renesas Electronics Corporation
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