Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

2011-06-14

2011-06-14

Lee, Calvin (Department: 2892)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S738000

Reexamination Certificate

active

07960271

ABSTRACT:
The present invention provides a semiconductor device that can suppresses poor connection caused by the variation of the heights of bumps during reflow heating, can be applied to a narrow array pitch, and can freely adjust the heights of the bumps.

REFERENCES:
patent: 6372622 (2002-04-01), Tan et al.
patent: 6426281 (2002-07-01), Lin et al.
patent: 6756294 (2004-06-01), Chen et al.
patent: 2006/0189114 (2006-08-01), Seto et al.
patent: 10-41307 (1998-02-01), None

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