Semiconductor device and method of manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated...

Reexamination Certificate

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Reexamination Certificate

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10918485

ABSTRACT:
The present invention provides a semiconductor device which do not form parasitic transistors in device isolation regions and is capable of narrowing device-to-device intervals, and a method of manufacturing the semiconductor device. The method includes a step for anisotropically etching spots that serve as active regions of a sapphire substrate and causing their ends to become substantially normal to the surface of the sapphire substrate, a step for forming a silicon layer so as to be thicker than an etching depth, a step for implanting silicon ions to amorphize the silicon layer, a step for performing annealing and thereby recrystallizing the amorphized silicon layer, and a step for planarizing the recrystallized silicon layer until the sapphire substrate is exposed, thereby to leave the silicon layer that serves as each of the active regions, whereby device-to-device isolation regions can be formed normal to the sapphire substrate.

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patent: 4983251 (1991-01-01), Haisma et al.
patent: 6228691 (2001-05-01), Doyle
patent: 6399429 (2002-06-01), Yamoto et al.
patent: 05-326692 (1993-12-01), None
patent: 2000-021790 (2000-01-01), None
patent: 2000-223419 (2000-08-01), None

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