Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2005-05-24
2005-05-24
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S773000, C257S784000
Reexamination Certificate
active
06897570
ABSTRACT:
A highly reliable semiconductor device provided herein can prevent a junction between a pad and a wire from coming off, and pads from peeling off an underlying insulating layer on the interface thereof. The semiconductor device has plugs formed in a region in which an electrode pad is formed over a substrate. The plugs protrude into the electrode pad.
REFERENCES:
patent: 6500748 (2002-12-01), Anand
patent: 2000-114309 (2000-04-01), None
patent: 2000-269265 (2000-09-01), None
Haruta Ryo
Matsuzawa Tomoo
Nakajima Takashi
Nakajima Yasuyuki
Okutani Ken
Potter Roy
Renesas Technology Corporation
Townsend and Townsend / and Crew LLP
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