Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2011-01-11
2011-01-11
Malsawma, Lex (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257SE23040, C257SE23018
Reexamination Certificate
active
07868466
ABSTRACT:
A method of manufacturing a semiconductor device comprises: a first step of interposing a thermosetting anisotropic conductive material between a substrate and a semiconductor chip; a second step in which pressure and heat are applied between the semiconductor chip and the substrate, an interconnect pattern and electrodes are electrically connected, and the anisotropic conductive material is spreading out beyond the semiconductor chip and is cured in the region of contact with the semiconductor chip; and a third step in which the region of the anisotropic conductive material other than the region of contact with the semiconductor chip is heated.
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Malsawma Lex
Oliff & Berridg,e PLC
Seiko Epson Corporation
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