Semiconductor device and method of manufacture thereof,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE23040, C257SE23018

Reexamination Certificate

active

07868466

ABSTRACT:
A method of manufacturing a semiconductor device comprises: a first step of interposing a thermosetting anisotropic conductive material between a substrate and a semiconductor chip; a second step in which pressure and heat are applied between the semiconductor chip and the substrate, an interconnect pattern and electrodes are electrically connected, and the anisotropic conductive material is spreading out beyond the semiconductor chip and is cured in the region of contact with the semiconductor chip; and a third step in which the region of the anisotropic conductive material other than the region of contact with the semiconductor chip is heated.

REFERENCES:
patent: 4811081 (1989-03-01), Lyden
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5136365 (1992-08-01), Pennisi et al.
patent: 5318651 (1994-06-01), Matsui et al.
patent: 5378859 (1995-01-01), Shirasaki et al.
patent: 5394014 (1995-02-01), Ishikawa et al.
patent: 5397864 (1995-03-01), Rai et al.
patent: 5473119 (1995-12-01), Rosenmayer et al.
patent: 5535101 (1996-07-01), Miles et al.
patent: 5545281 (1996-08-01), Matsui et al.
patent: 5578527 (1996-11-01), Chang et al.
patent: 5627405 (1997-05-01), Chillara
patent: 5814401 (1998-09-01), Gamota et al.
patent: 5892289 (1999-04-01), Tokuno
patent: 5895971 (1999-04-01), Nakanishi
patent: 5918113 (1999-06-01), Higashi et al.
patent: 6011315 (2000-01-01), Toyosawa et al.
patent: 6058021 (2000-05-01), Yamamoto
patent: 6061248 (2000-05-01), Otani et al.
patent: 6063649 (2000-05-01), Yoshino
patent: 6077382 (2000-06-01), Watanabe
patent: 6081038 (2000-06-01), Murayama
patent: 6157085 (2000-12-01), Terashima
patent: 6208525 (2001-03-01), Imasu et al.
patent: 6225704 (2001-05-01), Sumita et al.
patent: 6281450 (2001-08-01), Urasaki et al.
patent: 6303873 (2001-10-01), Mori et al.
patent: 6322936 (2001-11-01), Nishikawa et al.
patent: 6426166 (2002-07-01), Nishikawa et al.
patent: 0 824 270 (1998-02-01), None
patent: 356050546 (1979-09-01), None
patent: 02-165073 (1990-06-01), None
patent: A-05-072402 (1993-03-01), None
patent: 06-021149 (1994-01-01), None
patent: A-07-049413 (1995-02-01), None
patent: A-07-225391 (1995-08-01), None
patent: A-07-312377 (1995-11-01), None
patent: 09-219579 (1997-08-01), None
patent: A-09-289221 (1997-11-01), None
patent: A 10-4122 (1998-01-01), None
patent: A-10-004124 (1998-01-01), None
patent: A-10-004126 (1998-01-01), None
patent: A 10-4126 (1998-01-01), None
patent: A-10-084014 (1998-03-01), None
patent: A 10-84014 (1998-03-01), None
patent: A-10-098076 (1998-04-01), None
patent: A-10-116855 (1998-05-01), None
patent: A-10-125725 (1998-05-01), None
patent: A 10-135245 (1998-05-01), None
patent: A-10-168411 (1998-06-01), None
patent: A-11-067795 (1999-03-01), None
patent: A-11-067979 (1999-03-01), None
patent: A-11-514944 (1999-12-01), None
patent: A-2000-021935 (2000-01-01), None
patent: A-2000-022329 (2000-01-01), None
patent: WO 96/42106 (1996-12-01), None
patent: WO 98/10334 (1998-03-01), None
patent: WO 98/37444 (1998-08-01), None
patent: WO 9900842 (1999-01-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method of manufacture thereof,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method of manufacture thereof,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of manufacture thereof,... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2707377

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.