Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
Patent
1998-07-13
2000-12-19
Tsai, Jey
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
257759, 257762, 257763, 257765, 257506, 257508, 257522, 438622, H01L 214763
Patent
active
061627402
ABSTRACT:
A semiconductor device according to the present invention includes insulating branches which are formed as an interlayer insulating film on a semiconductor substrate. The interlayer insulating film has holes (voids) between the branches to thereby reduce electrostatic capacitance between stacked layers within a semiconductor device.
REFERENCES:
patent: 5523615 (1996-06-01), Cho et al.
patent: 5548159 (1996-08-01), Jeng
patent: 5789818 (1998-08-01), Havemann
patent: 5789819 (1998-08-01), Gnade et al.
patent: 5847464 (1998-12-01), Singh et al.
patent: 5936295 (1999-08-01), Havemann et al.
patent: 5945203 (1999-08-01), Soane
patent: 5955786 (1999-09-01), Avanzino et al.
patent: 5994776 (1999-11-01), Fang et al.
Gurley Lynne A.
NEC Corporation
Tsai Jey
LandOfFree
Semiconductor device and method of forming semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and method of forming semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of forming semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-270964