Semiconductor device and method of fabrication thereof

Details Semiconductor device and method of fabrication thereof Semiconductor device and method of fabrication thereof

2009-07-27

2011-11-01

Toledo, Fernando L (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S686000, C257S723000

Reexamination Certificate

active

08049342

ABSTRACT:
A semiconductor device is formed of two or more dice of similar dimensions and bond pad arrangement, in which bond pads are located in fields along less than three edges of the active surface of each die. A first die is attached to a substrate and subsequent die or dice are attached in a vertical sequence atop the first die, each in an offset configuration from the next lower die to expose the bond pads thereof for conductive bonding to metallization of the substrate. The multiple chip device permits a plurality of dice to be stacked in a high density low profile device. A particularly useful application is the formation of stacked mass storage flash memory package.

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