Semiconductor device and method of fabrication thereof

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

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438231, 438514, 438520, 438528, 438530, 438531, 438536, 438683, H01L 2100, H01L 2184

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active

060837802

ABSTRACT:
A semiconductor device and a method of fabricating such a semiconductor device in which a silicon nitride film constituting a protective film for ion implantation is used for improving the device structure in order that conversion of a metal film into a silicide for reducing the resistance of a shallow-junction diffused layer may not be prevented by the knock-on phenomenon of oxygen, thereby reduce the fabrication cost. A silicon nitride film, which is used as a protective film for ion implantation into a substrate and a gate polysilicon, is processed into side walls of the gate polysilicon thereby to omit the step of forming side walls by a silicon oxide film. Further, in the case where boron is diffused into the gate polysilicon, boron diffusion is suppressed by nitrogen knock-on, thereby preventing boron from going through the gate oxide film.

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