Semiconductor device and method of fabricating the same

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357 65, 357 67, 357 71, 357 72, 428620, 428632, 428634, H01L 2348, H01L 2944, H01L 2952, H01L 2960

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050198912

ABSTRACT:
A semiconductor device and the method of fabricating the semiconductor device include a semiconductor substrate and a plurality of conductor films formed on the substrate. Each of the conductor films is made of aluminum alloy including at least one element selected from palladium and platinum and, more preferably, further including at least one element selected from lithium, beryllium, magnesium, manganese, iron, cobalt, nickel, copper, lanthanum, cerium, chromium hafnium, zirconium, cadmium, titanium, tungsten, vanadium, tantalum, and niobium, with a protective film which includes oxide of the selected one of palladium and platinum being formed on the side wall of the conductor film.

REFERENCES:
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patent: 4800419 (1989-01-01), Long et al.
patent: 4827326 (1989-05-01), Altman et al.
patent: 4843453 (1989-06-01), Hopper et al.
Kobuchi et al., "Development of Corrosion Resistant Al Alloy Conductor for Semiconductors", ELS, 172nd, vol. 87-2, #280, pp. 396-397.

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