Semiconductor device and method of enveloping an integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S791000, C257S792000, C257S793000, C257S794000

Reexamination Certificate

active

07098545

ABSTRACT:
A package of a semiconductor device comprising an integrated circuit (10) generally comprises an inner layer (21) and an outer layer (16), which layers (16,21) have a mutual interface (24). An improved stability of the package is realized in that the interface (24) encloses a delamination area (22), which area (22) is isolated from any bond pads (18) of the integrated circuit (10). The delamination area (22) may be created by a pattern-wise activation of a surface of the inner layer (21). A quantity of a curable polymer may be disposed on this surface to achieve this.

REFERENCES:
patent: 4849857 (1989-07-01), Butt et al.
patent: 4984059 (1991-01-01), Kubota et al.
patent: 5036024 (1991-07-01), Mine et al.
patent: 5171716 (1992-12-01), Cagan et al.
patent: 5629566 (1997-05-01), Doi et al.
patent: 5863810 (1999-01-01), Kaldenberg
patent: 5959362 (1999-09-01), Yoshino
patent: 6046506 (2000-04-01), Hikita et al.
patent: 6087006 (2000-07-01), Tanaka et al.
patent: 6147374 (2000-11-01), Tanaka et al.
patent: 6429513 (2002-08-01), Shermer et al.
patent: 6624058 (2003-09-01), Kazama
patent: 6707166 (2004-03-01), Noguchi
patent: 0 407 585 (1991-01-01), None
patent: 0 501 564 (1992-02-01), None
DJennas et al: “Investigation of Plasma Effects on Plastic Packages Delamination and Cracking”, Dec. 16, 1993, No. 08, 8091 IEEE Transactions on Components, Hybrids, and Manufacturing Technology, New York, US.
English Translation of JP63-151054.
English Translation of JP62-185343.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method of enveloping an integrated... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method of enveloping an integrated..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of enveloping an integrated... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3688384

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.