Semiconductor device and method for the fabrication thereof

Details Semiconductor device and method for the fabrication thereof Semiconductor device and method for the fabrication thereof

2005-08-02

2005-08-02

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

active

06924173

ABSTRACT:
Disclosed is a semiconductor device10comprising a first semiconductor element11with an arrangement of first element electrodes12, a second semiconductor element13with an arrangement of second element electrodes14, a connection member15electrically connecting together a portion12bof the first element electrodes12and the second element electrodes14, an insulation layer17covering a major surface11aof the first semiconductor element11and a backside surface13bof the second semiconductor element13, a wiring layer22formed on the insulation layer17and electrically connected to the first element electrode portion12bexposed in an opening portion21, and an external electrode23formed, as a portion of the wiring layer22, on the insulation layer17.

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