Semiconductor device and method for regional stress control

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Self-aligned

Reexamination Certificate

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C438S519000

Reexamination Certificate

active

11111450

ABSTRACT:
Mechanical stress control may be achieved using materials having selected elastic moduli. These materials may be selectively formed by implantation, may be provided as a plurality of buried layers interposed between the substrate and the active area, and may be formed by replacing selected portions of one or more buried layers. Any one or more of these methods may be used in combination. Mechanical stress control may be useful in the channel region of a semiconductor device to maximize its performance. In addition, these same techniques and structures may be used for other purposes besides mechanical stress control.

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