Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2004-10-04
2009-10-20
Reichard, Dean A. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
Reexamination Certificate
active
07606046
ABSTRACT:
A semiconductor device including a PCB including conductive patterns formed on at least one surface of the PCB, external connection terminals including at least one ground terminal and coupled to the conductive patterns, at least one semiconductor chip mounted on a surface of the PCB, and an ESD protection pattern being coupled to at least one of the least one ground terminal, the at least one ground terminal not being coupled to the conductive patterns. A semiconductor memory device, including a PCB, a memory chip mounted on a first surface of the PCB, external connection terminals formed on a second surface of the PCB, and a first ESD protection pattern being coupled to at least one ground terminal. A method of mitigating ESD in a semiconductor device, including mounting a chip on a PCB, forming conductive patterns on the PCB, and forming at least one ESD protection pattern on the PCB, the ESD protection pattern being connected to a ground terminal and not being coupled to the conductive patterns.
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Korean Office Action.
Han Chan-Min
Han Sang-Guk
Getachew Abiy
Harness & Dickey & Pierce P.L.C.
Reichard Dean A.
Samsung Electronics Co,. Ltd.
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