Semiconductor device and method for manufacturing the same

Details Semiconductor device and method for manufacturing the same Semiconductor device and method for manufacturing the same

2011-04-05

2011-04-05

Louie, Wai-Sing (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With electrical contact in hole in semiconductor

C257S632000, C257S635000, C257S684000, C257S686000, C257S689000, C257SE23010

Reexamination Certificate

active

07919835

ABSTRACT:
The present invention provides a semiconductor device having a low-k film including an interconnect layer and a highly-reliable through-substrate contact plug. The semiconductor device includes:a semiconductor substrate having a first surface and a second surface facing each other;a first insulating film formed on the first surface of the semiconductor substrate and having a specific permittivity of 4 or higher;a circuit constituent element formed on the first surface of the semiconductor substrate and covered with the first insulating film);a contact plug formed in the first insulating film and electrically connected to the circuit constituent element;a through-substrate contact plug penetrating through the semiconductor substrate and the first insulating film;a second insulating film formed on the first insulating film and having a specific permittivity of 3.5 or lower;an interconnect layer formed in the second insulating film and electrically connected to the through-substrate contact plug and the contact plug;a first electrode formed in an exposed state and external to the second insulating film and electrically connected to the interconnect layer; anda second electrode formed in an exposed state and external to the second surface of the semiconductor substrate and electrically connected to the through-substrate contact plug.

REFERENCES:
patent: 6707157 (2004-03-01), Hoshino
patent: 2002/0027293 (2002-03-01), Hoshino
patent: 2005/0101040 (2005-05-01), Lai et al.
patent: 2005/0221601 (2005-10-01), Kawano
patent: 2005/0233581 (2005-10-01), Soejima et al.
patent: 2009/0014881 (2009-01-01), Endo et al.
patent: WO 2005/022631 (2005-03-01), None

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