Semiconductor device and method for manufacturing the same

Details Semiconductor device and method for manufacturing the same Semiconductor device and method for manufacturing the same

2008-12-03

2011-10-18

Landau, Matthew (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S637000, C257S758000, C257SE21575

Reexamination Certificate

active

08039387

ABSTRACT:
A semiconductor device and a method for manufacturing the same includes forming a via pattern having a matrix form in a dielectric layer. The via pattern includes a via slit provided at the center of the via pattern and a plurality of via holes provided at an outer periphery of the via pattern and surrounding the via slit. Metal plugs are formed in the via holes.

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