Semiconductor device and method for manufacturing the same

Details Semiconductor device and method for manufacturing the same Semiconductor device and method for manufacturing the same

2007-10-11

2010-08-31

Purvis, Sue (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257SE23068, C438S617000

Reexamination Certificate

active

07786580

ABSTRACT:
A semiconductor chip is characterized by a structure including a semiconductor chip on which electrode pads are formed, bumps which are formed on the respective electrode pads and which have projection sections, an insulating layer formed on the semiconductor chip, and a conductive pattern to be connected to the bumps, wherein extremities of the projection sections are inserted into the conductive pattern and the inserted extremities are flattened.

REFERENCES:
patent: 6096577 (2000-08-01), Hashimoto
patent: 2001/0013652 (2001-08-01), Hino et al.
patent: 2002/0175409 (2002-11-01), Tsubosaki
patent: 2004/0115868 (2004-06-01), Ono
patent: 2004/0159958 (2004-08-01), Funaki
patent: 9-64049 (1997-03-01), None

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