Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-01-26
2008-12-30
Baumeister, Bradley W. (Department: 2891)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S508000
Reexamination Certificate
active
07470609
ABSTRACT:
A semiconductor device including a multilevel wiring with a small interwiring capacitance is provided by comprising a wiring, a conductive film formed on an upper surface of the wiring to prevent diffusion of a wiring material, and an insulating film which is constituted of low dielectric constant insulating films stacked to form at least two layers, an interface thereof being positioned in a side face of the wiring.
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Tsumura Kazumichi
Usui Takamasa
Anya Igwe U.
Baumeister Bradley W.
Foley & Lardner LLP
Kabushiki Kaisha Toshiba
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