Semiconductor device and method for manufacturing the same

Details Semiconductor device and method for manufacturing the same Semiconductor device and method for manufacturing the same

2005-03-09

2008-08-26

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S781000, C257S782000, C257S784000, C257S786000, C257SE33066, C257SE23001, C257SE23020, C257SE23021

Reexamination Certificate

active

07417324

ABSTRACT:
A semiconductor device is composed of a semiconductor chip, aluminum pads formed on the semiconductor chip, alloy ball bumps, which are formed on the aluminum pads, containing gold and Pd, and gold wires, which are connected to the alloy ball bumps, having a surface made of gold. The alloy ball bumps may be composition containing gold not less than 98 mass % to not more than 99.5 mass % and palladium not less than 0.5 mass % to not more than 2 mass %. The semiconductor device having above configuration is excellent in long-term reliability.

REFERENCES:
patent: 4717066 (1988-01-01), Goldenberg et al.
patent: 5366692 (1994-11-01), Ogashiwa
patent: 6541848 (2003-04-01), Kawahara et al.
patent: 6815789 (2004-11-01), Tiziani et al.
patent: 11-097476 (1999-04-01), None
patent: 2001-015677 (2001-01-01), None
patent: 2001-237263 (2001-08-01), None

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