Semiconductor device and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S347000, C257S349000, C257S354000

Reexamination Certificate

active

06992358

ABSTRACT:
Disclosed is a semiconductor device comprising an underlying insulating film having a depression, a semiconductor structure which includes a first semiconductor portion having a portion formed on the underlying insulating film and a first overlap portion which overlaps the depression, a second semiconductor portion having a portion formed on the underlying insulating film and a second overlap portion which overlaps the depression, and a third semiconductor portion disposed between the first and second semiconductor portions and having a portion disposed above the depression, wherein overlap width of the first overlap portion and overlap width of the second overlap portion are equal to each other, a gate electrode including a first electrode portion covering upper and side surfaces of the third semiconductor portion and a second electrode portion formed in the depression, and a gate insulating film interposed between the semiconductor structure and the gate electrode.

REFERENCES:
patent: 4979014 (1990-12-01), Hieda et al.
patent: 6437404 (2002-08-01), Xiang et al.
patent: 6538916 (2003-03-01), Ohsawa
patent: 6580132 (2003-06-01), Chan et al.
patent: 6639246 (2003-10-01), Honda
patent: 6646307 (2003-11-01), Yu et al.
patent: 6687152 (2004-02-01), Ohsawa
patent: 6724046 (2004-04-01), Oyamatsu
patent: 6740938 (2004-05-01), Tsunoda et al.
patent: 6744390 (2004-06-01), Stice
patent: 6800513 (2004-10-01), Horiuchi et al.
patent: 6822071 (2004-11-01), Stephens et al.
patent: 2003/0209761 (2003-11-01), Yagishita et al.
patent: 2004/0150520 (2004-08-01), Barrie
patent: 2004/0178451 (2004-09-01), Yagishita et al.
patent: 2005/0040464 (2005-02-01), Miura
patent: 2005/0051843 (2005-03-01), Inaba
patent: 2005/0110085 (2005-05-01), Zhu et al.
Yang et al.; “25 nm CMOS Omega FETs”; IEDM, pp. 255-258, (2002).
Colinge et al.; “Silicon-on-Insulator “Gate-all-Around Device””; IEDM, pp. 595-598, (1990).
Hieda; “Semiconductor Device and Method for Manufacturing the Same”; U.S. Appl. No. 09/916,509, filed Jul. 30, 2001.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for manufacturing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3597308

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.