Semiconductor device and method for manufacturing the same

Details Semiconductor device and method for manufacturing the same Semiconductor device and method for manufacturing the same

2006-04-25

2006-04-25

Blum, David (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S637000, C438S638000, C438S639000

Reexamination Certificate

active

07033935

ABSTRACT:
The invention simplifies the manufacturing processes and increases the yield. A semiconductor wafer equipped with a plurality of semiconductor chip forming sections is prepared. An electrical characteristic examination is conducted for each of the semiconductor chip forming sections to determine good product sections or bad product sections. At least another segmented semiconductor chip is electrically connected to each of the semiconductor chip forming sections that are determined to be good product sections.

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S. Wolf and R.N. Touber, Silicon Processing for the VLSI Era, v. 1, 2nd edition, Lattice Press, 2000, p. 784.

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