Semiconductor device and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Junction field effect transistor

Reexamination Certificate

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C257S109000, C257S281000, C438S169000, C438S534000

Reexamination Certificate

active

06900483

ABSTRACT:
A Schottky diode includes a semiconductor substrate made of 4H—SiC, an epitaxially grown 4H—SiC layer, an ion implantation layer, a Schottky electrode, an ohmic electrode, and an insulative layer made of a thermal oxide film. The Schottky electrode and the insulative layer are not in contact with each other, with a gap being provided therebetween, whereby an altered layer does not occur. Therefore, it is possible to suppress the occurrence of a leak current.

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patent: 5814832 (1998-09-01), Takeda et al.
patent: 5895260 (1999-04-01), Bhatnagar et al.
patent: 58-210666 (1983-12-01), None
patent: WO 00/13236 (2000-03-01), None
Itoh, Akira et al.; “Excellent Reverse Blocking Characteristics of High-Voltage 4H-SiC Schottky Rectifiers with Boron-Implanted Edge Termination”; Electron Device Letters; vol. 17, No. 3, Mar. 1996.
Saxena, Vik et al.; “High-Voltage Ni- and Pt-SiC Schottky Diodes Utilizing Metal Field Plates Termination”; IEEE Transaction on Electron Devices; vol. 46, No. 3; Mar. 1999.
Wahab, Q. et al.; “A 3 kv Schottky Barrier Diode in 4H-SiC”; Appl. Ohys. Lett. 72(4); Jan. 26, 1998.
C.E. Weitzel; “A Review of GaAs MESFET Gate Electrode Fabrication Technologies”; Journal of the Electrochemical Society; pp. 409C-416C; USA; 1986.
European Patent Office Communication regarding Patent App. No. EP 02012326; Mailed Mar. 26, 2004.

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