Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation
Reexamination Certificate
2011-08-16
2011-08-16
Dickey, Thomas L (Department: 2893)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
Insulated gate formation
C977S742000
Reexamination Certificate
active
07998850
ABSTRACT:
Disclosed herein are a semiconductor device and a method for manufacturing the same. The method includes forming a gate structure using a carbon nano tube (CNT). In order to prevent reduction of the gate resistance and the short channel effect, a CNT gate having a grown CNT pattern with a half-cylinder shape is formed over a recess of a semiconductor substrate. The CNT gate has the same effect as a recess gate, and can prevent the short channel effect, improve the speed, and the lower power characteristic of semiconductor devices.
REFERENCES:
patent: 7084507 (2006-08-01), Awano
patent: 2003/0011036 (2003-01-01), Bethune et al.
patent: 2004/0016928 (2004-01-01), Ravi et al.
patent: 2004/0023431 (2004-02-01), Wang et al.
patent: 10-261659 (1998-09-01), None
patent: 10-2006-0023064 (2006-03-01), None
patent: 10-2006-0029547 (2006-04-01), None
patent: 10-2007-0117666 (2007-12-01), None
M. Quirk et al., “Semiconductor manufacturing technology”, 2001, Printice-Hall. Inc, pp. 435-445, Table 16.5).
Jang Chi Hwan
Yeo Tae Yeon
Dickey Thomas L
Hynix / Semiconductor Inc.
Marshall & Gerstein & Borun LLP
Yushin Nikolay
LandOfFree
Semiconductor device and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for manufacturing the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2710809