Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent
1997-09-08
1999-03-30
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
257690, 257737, 257780, H01L 2348, H01L 2352, H01L 2940
Patent
active
058893334
ABSTRACT:
A semiconductor device includes a device body including at least an LSI chip, and a lead structure having a base which is flexible and a plurality of pins which project from both sides of the base. The lead structure is integrated with the device body so that first ends of the plurality of pins are electrically connected to the LSI chip. The semiconductor device is manufactured in accordance with two steps of forming the lead structure and of integrating the lead structure with the deice body so that the first ends of the plurality of pins are electrically connected to the LSI chip.
REFERENCES:
patent: 4530002 (1985-07-01), Kanai
patent: 5126818 (1992-06-01), Takami et al.
patent: 5229646 (1993-07-01), Tsumura
patent: 5302849 (1994-04-01), Cavasin
patent: 5479051 (1995-12-01), Waki et al.
Kasai Junichi
Mizukoshi Masataka
Takenaka Masashi
Yamashita Taturou
Clark Jhihan B.
Fujitsu Limited
Saadat Mahshid
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