Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2011-07-19
2011-07-19
Picardat, Kevin M (Department: 2822)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S151000, C438S301000, C438S585000, C438S783000
Reexamination Certificate
active
07981811
ABSTRACT:
A base layer is formed on an insulating substrate, and a semiconductor layer is formed in localized fashion thereon. A gate insulating film is then formed so as to cover the semiconductor layer, and a gate electrode is formed on a portion of the gate insulating film. An impurity is then implanted into the semiconductor layer via the gate insulating film, and a source region, a drain region, and an LDD region are formed. The gate insulating film is etched with dilute hydrofluoric acid. An electrode-protecting insulating film is then formed so as to cover the gate electrode, and the entire surface of the surface layer portion of the electrode-protecting insulating film is etched away using dilute hydrofluoric acid. Carrier traps introduced into the electrode-protecting insulating film and the gate insulating film are thereby removed.
REFERENCES:
patent: 5187551 (1993-02-01), Shoji et al.
patent: 6396077 (2002-05-01), Kubota et al.
patent: 6461907 (2002-10-01), Imai
patent: 6818496 (2004-11-01), Dennison et al.
patent: 7374981 (2008-05-01), Yamaguchi et al.
patent: 2004/0132293 (2004-07-01), Takayama et al.
patent: 2005/0012151 (2005-01-01), Yamaguchi et al.
patent: 10-27911 (1998-01-01), None
patent: 3177360 (2001-04-01), None
patent: 2004140407 (2004-05-01), None
Korenari Takahiro
Matsuzaki Tadahiro
Mori Shigeru
Tanabe Hiroshi
NEC Corporation
NEC LCD Technologies, Ltd
Picardat Kevin M
Sughrue & Mion, PLLC
LandOfFree
Semiconductor device and method for manufacturing same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and method for manufacturing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for manufacturing same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2625012