Semiconductor device and method for manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S407000, C257S411000, C257SE21161, C257SE21199, C257SE21632, C257SE29255

Reexamination Certificate

active

07859059

ABSTRACT:
There is provided a semiconductor device having excellent device characteristics and reliability in which Vthvalues of an nMOS transistor and a pMOS transistor are controlled to be values necessary for a low-power device. The semiconductor device includes a pMOS transistor and an nMOS transistor formed by using an SOI substrate. The pMOS transistor is a fully depleted MOS transistor including a first gate electrode comprising at least one type of crystalline phase selected from the group consisting of a WSi2crystalline phase, an MoSi2crystalline phase, an NiSi crystalline phase, and an NiSi2crystalline phase as silicide region (1). The nMOS transistor is a fully depleted MOS transistor comprising at least one type of crystalline phase selected from the group consisting of a PtSi crystalline phase, a Pt2Si crystalline phase, an IrSi crystalline phase, an Ni2Si crystalline phase, and an Ni3Si crystalline phase as silicide region (2).

REFERENCES:
patent: 6992357 (2006-01-01), Matsuo et al.
patent: 7148546 (2006-12-01), Visokay et al.
patent: 7226827 (2007-06-01), Schram et al.
patent: 7592674 (2009-09-01), Takahashi et al.
patent: 2005/0051845 (2005-03-01), Nakagawa et al.
patent: 2006/0131676 (2006-06-01), Saito et al.
patent: 2007/0284671 (2007-12-01), Tsutsumi et al.
patent: 2008/0261394 (2008-10-01), Wang et al.
patent: 2003-258121 (2003-09-01), None
patent: 2004-221226 (2004-08-01), None
patent: 2004-356472 (2004-12-01), None
patent: 2005-085949 (2005-03-01), None
patent: 2005-123625 (2005-05-01), None
patent: 2005-129551 (2005-05-01), None
patent: 2006-156807 (2006-06-01), None
patent: 2006-001272 (2006-05-01), None
D1: Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International vol. , Issue , Dec. 13-15, 2004, pp. 83-86.
D2: Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International, pp. 911-914.
D3: Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International, pp. 649-652.
D4: Electron Devices Meeting, 2002. IEDM '02. Digest. International, pp. 247- 250.
D5: Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International, pp. 227-230.
D6: Electron Devices Meeting, 2003. IEDM apos;03 Technical Digest. IEEE International, pp. 315-318.
D7: Electron Devices Meeting, 2002. IEDM '02. Digest. International, pp. 359-362.
D8: Electron Devices Meeting, 1985 International, pp. 415-418.
D9: 36th IEEE Semiconductor Interface Specialists Conference, Dec. 1-3, 2005.
D10: Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International vol. , Issue , Dec. 13-15, 2004 pp. 91-94.
D11: 2005 Symposium onVLSI Technology Digest of Technical Papers, pp. 86-87.
D12: 2005 Symposium onVLSI Technology Digest of Technical Papers, pp. 68-69.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method for manufacturing same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method for manufacturing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for manufacturing same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4213664

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.