Semiconductor device and method for forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257308, 257406, 257411, 257640, H01L 2934, H01L 2186

Patent

active

054689872

ABSTRACT:
In a thin-film insulated gate type field effect transistor having a metal gate in which the surface of the gate electrode is subjected to anodic oxidation, a silicon nitride film is provided so as to be interposed between the gate eiectrode and the gate insulating film to prevent invasion of movable ions into a channel, and also to prevent the breakdown of the gate insulating film due to a potential difference between the gate electrode and the channel region. By coating a specific portion of the gate eiectrode with metal material such as chrome or the like for the anodic oxidation, and then removing only the metal material such as chrome or the like together with the anodic oxide of the metal material such as chrome or the like, an exposed portion of metal gate (e.g. aluminum) is formed, and an upper wiring is connected to the exposed portion. Further, an aluminum oxide or silicon nitride is formed as an etching stopper between the gate electrode and the gate insulating film or between the substrate and the layer on the substrate, so that the over-etching can be prevented and the flatness of the eiement can be improved. In addition, a contact is formed in no consideration of the concept "contact hole".

REFERENCES:
patent: 4015281 (1977-03-01), Nagata et al.
patent: 4015781 (1977-03-01), Nagata et al.
patent: 4042945 (1977-08-01), Lin et al.
patent: 4485393 (1984-11-01), Kumamaru et al.
patent: 4866498 (1989-09-01), Myers
patent: 5041888 (1991-08-01), Possin et al.
patent: 5051794 (1991-09-01), Mori
patent: 5177577 (1993-01-01), Taniguchi et al.
patent: 5225356 (1993-07-01), Omura et al.
patent: 5289030 (1994-02-01), Yamazaki et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method for forming the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method for forming the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for forming the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1139353

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.