Semiconductor device and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S412000, C257SE21625

Reexamination Certificate

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07741684

ABSTRACT:
The semiconductor device comprises a gate insulating film including a first dielectric film of HfxAl1-xOy(0.7<x<1) formed over a semiconductor substrate, and a second dielectric film different from the first dielectric film formed over the first dielectric film; and a gate electrode formed over the gate insulating film and including a polycrystalline silicon film, whereby the local abnormal growth of the polycrystalline silicon film in the process of forming the polycrystalline silicon film is prevented, and the gate leakage current can be much decreased.

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D.C. Gilmer et al., “Compatibility of Polycrystalline Silicon Gate Deposition with HfO2and Al2O3/HfO2Gate Dielectrics”, Appl. Phys. Lett., vol. 81, No. 7, pp. 1288-1290 , 2002.
M.-Y. Ho et al., “Suppressed Crystallization of Hf-based Gate Dielectrics by Controlled Addition of Al2O3 Using Atomic Layer Deposition,” App. Phys. Lett., pp. 4218-4220, vol. 81, No. 22, 2002.
Japanese Office Action mailed Nov. 10, 2009, issued in corresponding Japanese Application No. 2005-364379.

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