Semiconductor device and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257SE21410, C257SE29262

Reexamination Certificate

active

07626229

ABSTRACT:
A semiconductor device includes: a semiconductor substrate; a first semiconductor region formed in the reverse surface region of the semiconductor substrate and including a first conductivity type impurity; a second semiconductor region formed on the first semiconductor region in the semiconductor substrate and including a second conductivity type impurity; a third semiconductor region formed on the second semiconductor region in the semiconductor substrate and including a first conductivity type impurity; a trench passing through the second and third semiconductor regions and reaching the first semiconductor region; and a gate insulating film formed along the wall face of the trench; a gate electrode formed on the gate insulating film in the trench. Further, a pocket region including a second conductivity type impurity of which peak concentration is higher than that of the second semiconductor region is formed by a side of the trench between the second semiconductor region and the third semiconductor region.

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US Office Action for U.S. Appl. No. 11/016,713. Date Mailed: Jun. 7, 2006.
Japanese Office Action issued in Japanese Patent Application No. JP 2004-299698 mailed Apr. 24, 2004.
Japanese Office Action, with English Translation, issued in Corresponding Japanese Patent Application No. 2004-038878, dated on Nov. 6, 2007.

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