Semiconductor device and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S344000, C257S377000, C257S382000, C257S383000, C257S384000, C257S408000

Reexamination Certificate

active

06861704

ABSTRACT:
The semiconductor device comprises a gate electrode26formed on a semiconductor substrate10, a source region45ahaving a lightly doped source region42aand a heavily doped source region44a, a drain region45bhaving a lightly doped drain region42band a heavily doped drain region44b, a first silicide layer40cformed on the source region, a second silicide layer40dformed on the drain region, a first conductor plug54connected to the first silcide layer and a second conductor plug54connected to the second silicide layer. The heavily doped drain region is formed in the region of the lightly doped region except the peripheral region, and the second silicide layer is formed in the region of the heavily doped drain region except the peripheral region. Thus, the concentration of the electric fields on the drain region can be mitigated when voltages are applied to the drain region. Thus, even with the silicide layer formed on the source/drain region, sufficiently high withstand voltages of the high withstand voltage transistor can be ensured. Furthermore, the drain region alone has the above-described structure, whereby the increase of the source-drain electric resistance can be prevented while high withstand voltages can be ensured.

REFERENCES:
patent: 6-112219 (1994-04-01), None
patent: 9-260590 (1997-10-01), None
patent: 11-126900 (1999-05-01), None
patent: 11-195789 (1999-07-01), None

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