Semiconductor device manufacturing: process – Forming schottky junction – Using platinum group metal
Reexamination Certificate
2005-02-08
2005-02-08
Zarabian, Amir (Department: 2822)
Semiconductor device manufacturing: process
Forming schottky junction
Using platinum group metal
C438S580000, C438S575000, C438S570000
Reexamination Certificate
active
06852612
ABSTRACT:
The semiconductor device of the present invention includes: a gallium nitride (GaN) compound semiconductor layer; and a Schottky electrode formed on the GaN compound semiconductor layer, wherein the Schottky electrode contains silicon.
REFERENCES:
patent: 5705830 (1998-01-01), Siergiej et al.
patent: 5929467 (1999-07-01), Kawai et al.
patent: 6100174 (2000-08-01), Takatani
patent: 6239490 (2001-05-01), Yamada et al.
patent: 6281526 (2001-08-01), Nitta et al.
patent: 6316793 (2001-11-01), Sheppard et al.
patent: 6399413 (2002-06-01), Krutsick
patent: 63-217662 (1988-09-01), None
patent: 01-093173 (1989-04-01), None
patent: 10-209177 (1998-08-01), None
patent: 11-135770 (1999-05-01), None
patent: 11-297713 (1999-10-01), None
patent: 2000-208435 (2000-07-01), None
Q.Z. Liu et al., “Thermally stable PtSi Schotky contact on n-GaN”, Appl. Phys. Lett. 70 (10), Mar. 10, 1997, pp. 1275-1277.
Q.Z. Liu et al., “Ni an Ni silicide Schotky contacts on N-GaN”, J. of Appl. Phys. 84 (2) Jul. 15, 1998, pp. 881-886.
H.S. Venugopalan et al., “interfacial reactions between nickel thin films and GaN”, J. of Appl. Phys. 82 (2), Jul. 15, 997, pp. 650-654.
Notice of reasons of rejection (Dated May 21, 2002).
Ikeda Yoshito
Inoue Kaoru
Masato Hiroyuki
Nishii Katsunori
Matsushita Electric - Industrial Co., Ltd.
Nixon & Peabody LLP
Novacek Christy
Studebaker Donald R.
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