Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2005-07-19
2005-07-19
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S724000, C257S686000, C257S685000, C257S723000
Reexamination Certificate
active
06919641
ABSTRACT:
A semiconductor device includes: a substrate having in its principal surface first and second recessed portions formed adjacent to each other; and first and second semiconductor laser chips each having a portion that is inserted in one of the recessed portions. The depth of the recessed portions is smaller than the height of the first and second semiconductor laser chips that are disposed in the recessed portions.
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Onozawa Kazutoshi
Ueda Daisuke
Ueda Tetsuzo
Flynn Nathan J.
Matsushita Electric - Industrial Co., Ltd.
McDermott Will & Emery LLP
Wilson Scott R.
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