Semiconductor device and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

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Details

C257S724000, C257S686000, C257S685000, C257S723000

Reexamination Certificate

active

06919641

ABSTRACT:
A semiconductor device includes: a substrate having in its principal surface first and second recessed portions formed adjacent to each other; and first and second semiconductor laser chips each having a portion that is inserted in one of the recessed portions. The depth of the recessed portions is smaller than the height of the first and second semiconductor laser chips that are disposed in the recessed portions.

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patent: 11144307 (1999-05-01), None
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patent: 11-186651 (1999-07-01), None

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