Semiconductor device and method for fabricating the same

Details Semiconductor device and method for fabricating the same Semiconductor device and method for fabricating the same

1993-01-07

1995-12-05

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257787, H01L 2348, H01L 2946, H01L 2962, H01L 2964

Patent

active

RE0351091

ABSTRACT:
In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.

REFERENCES:
patent: 4024570 (1977-05-01), Hartmann et al.
patent: 4527185 (1985-07-01), Philofsky et al.
patent: 4541003 (1985-09-01), Otsuka et al.
patent: 4984059 (1991-01-01), Hartmann et al.
Japanese Unexamined Patent Publication (Kokai) No. 52-127756.

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