Semiconductor device and manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S704000, C257S706000, C257S720000, C257S675000, C257S666000

Reexamination Certificate

active

06847112

ABSTRACT:
A semiconductor device is designed to resist warpage of a heat sink with an inexpensive construction. The device comprises a heat sink, a pair of screwing pieces having inner end portions connected to ends of the heat sink and outer end portions formed with through spaces for screwing, a semiconductor chip fixed to a main surface of the heat sink, a seal covering a back side of the heat sink and partially covering the paired screwing pieces, first and second leads having outer end portions projecting from the seal member and inner end portions within the seal member near respective side faces of the heat sink, and conductive wires electrically connecting the leads and predetermined electrodes of a semiconductor chip.

REFERENCES:
patent: 5907474 (1999-05-01), Dolbear
patent: 20020025606 (2002-02-01), Kurihara et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and manufacturing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3433344

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.