Semiconductor device and manufacturing process therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S369000, C257S761000

Reexamination Certificate

active

07968947

ABSTRACT:
This invention provides a semiconductor device that can prevent a deviation of work function by adopting a gate electrode having a uniform composition and exhibits excellent operating characteristics by virtue of effective control of a Vth. The semiconductor device is characterized by comprising a PMOS transistor, an NMOS transistor, a gate insulating film comprising an Hf-containing insulating film with high permittivity, a line electrode comprising a silicide region (A) and a silicide region (B), one of the silicide regions (A) and (B) comprising a silicide (a) of a metal M, which serves as a diffusing species in a silicidation reaction, the other silicide region comprising a silicide layer (C) in contact with a gate insulating film, the silicide layer (C) comprising a silicide (b) of a metal M, which has a smaller atom composition ratio of the metal M than the silicide (a), and a dopant which can substantially prevent diffusion of the metal M in the silicide (b).

REFERENCES:
patent: 6599831 (2003-07-01), Maszara et al.
patent: 2003/0203609 (2003-10-01), Maszara et al.
patent: 2007/0004163 (2007-01-01), Fukada et al.
patent: 2009/0096032 (2009-04-01), Saitoh et al.
patent: 2000-77538 (2000-03-01), None
patent: 2005-129551 (2005-05-01), None
patent: 2005-228761 (2005-08-01), None
patent: 2005-524243 (2005-08-01), None
patent: 2005-252192 (2005-09-01), None
patent: 2005-294360 (2005-10-01), None
patent: 2006-5056 (2006-01-01), None
patent: WO 2007/026677 (2007-03-01), None
patent: WO 2007/060938 (2007-05-01), None
Kensuke Takahashi, et al., Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International: Dec. 13, 2004, p. 91-94.
D. Aime, et al., Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International: Dec. 13, 2004, p. 87-90.
PCT/IB/338.
PCT/IB/373.
English Language Translation of PCT/ISA/237.
Veloso A., et al., “Work function engineering by FUSI and its impact on the performance and reliability of oxynitride and Hf-silicate based MOSFETs”, IMEC, Kapeldreef '75, 3001 Leuven, Belgique,IEEE International Electron Devices Meeting 2004: ( IEDM technical digest) ( 50th annual meeting ) ( San Francisco, CA, Dec. 13-15, 2004 ) International Electron Devices Meeting, San Francisco CA , ETATS-UNIS (2004) 2004 , pp. 855-858[Note(s) : pagination multiple, ] [Document : 4 p.] (7 ref.), [Notes: “IEEE Catalog No. 04CH37602”—T.p. verso] ISBN 0-7803-8684-1.

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