Semiconductor device and manufacturing method thereof

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into...

Reexamination Certificate

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C438S795000

Reexamination Certificate

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08084338

ABSTRACT:
The depletion of a gate electrode (103) is suppressed in such a way that impurities are introduced into the gate electrode that is formed on a semiconductor substrate (101), with a gate insulating film (102) interposed between the gate electrode (103) and the semiconductor substrate (101), and that, by irradiating a laser beam onto the gate electrode (103), the introduced impurities are made to diffuse up to the interface between the gate electrode (103) and the gate insulating film (102).

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Japanese Office Action mailed Sep. 1, 2009, issued in corresponding Japanese Application No. 2005-500909.
Japanese Office Action dated Mar. 17, 2009; issued in corresponding Japanese Application No. 2005-500909.

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