Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

2007-07-13

2010-06-01

Pham, Thanh V (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE21598, C257SE23002, C438S107000

Reexamination Certificate

active

07728418

ABSTRACT:
A semiconductor device includes a plurality of chips comprising a plurality of first moisture-proof rings individually surrounding said plurality of chips, a second moisture-proof ring surrounding the entire plurality of chips, and a wire for connecting said plurality of chips to each other.

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patent: 1445837 (2003-10-01), None
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Translation of JP 2002134506 A.
Chinese Office Action mailed Jun. 20, 2008, issued in corresponding Chinese Application No. 200710136626.5.

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