Semiconductor device and manufacturing method thereof

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S149000

Reexamination Certificate

active

07601572

ABSTRACT:
In order to increase an aperture ratio, a part of or all of a gate electrode that overlaps with channel formation regions (213, 214) of a pixel TFT is caused to overlap with second wirings (source line or drain line) (154, 157). Additionally, a first interlayer insulating film (149) and a second interlayer insulating film (150c) are disposed between the gate electrode and the second wirings (154, 157) so as to decrease a parasitic capacitance.

REFERENCES:
patent: 5177592 (1993-01-01), Takahashi et al.
patent: 5365079 (1994-11-01), Kodaira et al.
patent: 5474942 (1995-12-01), Kodaira et al.
patent: 5552615 (1996-09-01), Kodaira et al.
patent: 5573959 (1996-11-01), Kodaira et al.
patent: 5594569 (1997-01-01), Konuma et al.
patent: 5608251 (1997-03-01), Konuma et al.
patent: 5620905 (1997-04-01), Konuma et al.
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5712495 (1998-01-01), Suzawa
patent: 5717224 (1998-02-01), Zhang
patent: 5923962 (1999-07-01), Ohtani et al.
patent: 6037199 (2000-03-01), Huang et al.
patent: 6057904 (2000-05-01), Kim et al.
patent: 6088070 (2000-07-01), Ohtani et al.
patent: 6136211 (2000-10-01), Qian et al.
patent: 6165824 (2000-12-01), Takano et al.
patent: 6271897 (2001-08-01), Ichikawa et al.
patent: 6294799 (2001-09-01), Yamazaki et al.
patent: 6297520 (2001-10-01), Kubo et al.
patent: 6306694 (2001-10-01), Yamazaki et al.
patent: 6313481 (2001-11-01), Ohtani et al.
patent: 6365915 (2002-04-01), Hirai et al.
patent: 6399960 (2002-06-01), Yamazaki et al.
patent: 6461899 (2002-10-01), Kitakado et al.
patent: 6555420 (2003-04-01), Yamazaki
patent: 6576926 (2003-06-01), Yamazaki et al.
patent: 6586766 (2003-07-01), Yamazaki et al.
patent: 6740599 (2004-05-01), Yamazaki et al.
patent: 6771342 (2004-08-01), Hirakata et al.
patent: 6967129 (2005-11-01), Yamazaki et al.
patent: 7001801 (2006-02-01), Yamazaki et al.
patent: 7016003 (2006-03-01), Hirakata et al.
patent: 7310121 (2007-12-01), Hirakata et al.
patent: 7365393 (2008-04-01), Yamazaki et al.
patent: 7371623 (2008-05-01), Yamazaki et al.
patent: 7442991 (2008-10-01), Yamazaki et al.
patent: 7505091 (2009-03-01), Hirakata et al.
patent: 2002/0006690 (2002-01-01), Yamazaki et al.
patent: 2009/0014724 (2009-01-01), Yamazaki et al.
patent: 0 650 197 (1995-04-01), None
patent: 0 984 492 (2000-03-01), None
patent: 1 017 108 (2000-07-01), None
patent: 1 031 873 (2000-08-01), None
patent: 1 103 946 (2001-05-01), None
patent: 2 122 419 (1984-01-01), None
patent: 07-130652 (1995-05-01), None
patent: 09-219453 (1997-08-01), None
patent: 09219453 (1997-08-01), None
patent: 9-318972 (1997-12-01), None
patent: 10-247735 (1998-09-01), None
patent: 11-097702 (1999-04-01), None
patent: 11-133463 (1999-05-01), None
patent: 2000-36598 (2000-02-01), None
patent: 2000-299469 (2000-10-01), None
patent: 2000-312007 (2000-11-01), None
patent: 2001-343933 (2001-12-01), None
Machine Translation of JP 09-219453.
1) YOSHIDA, T. et al, “A Full-Color Thresholdless Antiferroelectric LCD Exhibiting Wide Viewing Angle with Fast Response Time,” SID 97 Digest, pp. 841-844, (1997).
2) Furue, H. et al, “Characteristics and Driving Scheme of Polymer-Stabilized Monostabel FLCD Exhibiting Fast Response Time and High Contrast Ratio with Gray-Scale Capability,” SID 98 Digest, pp. 782-785, (1998).
3) Shimokawa, R. et al, “Characterization of High-Efficiency Cast-Si Cell Wafers by MBIC Measurement,” Japanese Journal of Applied Physics, vol. 27, No. 5, pp. 751-758, (May 1998).
European Search Report re application No. EP 00111706.8, dated Jul. 27, 2009.

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