Semiconductor device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S298000, C257S300000, C257S301000, C257S302000, C257S303000, C257S314000, C257S305000, C257S311000, C438S238000, C438S239000, C438S242000, C438S243000, C438S386000, C438S399000

Reexamination Certificate

active

06849890

ABSTRACT:
A semiconductor device comprises a semiconductor substrate having first conductivity type, a trench capacitor, provided in the substrate, having a charge accumulation region, a gate electrode provided on the substrate via a gate insulating film, a gate side wall insulating film provided on a side surface of the gate electrode, drain and source regions, provided in the substrate, having a second conductivity type, an isolation insulating film provided adjacent to the trench capacitor in the substrate to cover an upper surface of the charge accumulation region, a buried strap region having the second conductivity type, the buried strap region being provided to electrically connect an upper portion of the charge accumulation region to the source region in the substrate, and a pocket implantation region having the first conductivity type, the pocket implantation region being provided below the drain and source regions and being spaced apart from the strap region.

REFERENCES:
patent: 6238967 (2001-05-01), Shiho et al.
patent: 6274441 (2001-08-01), Mandelman et al.
patent: 6329235 (2001-12-01), Kuo
patent: 6355954 (2002-03-01), Gall et al.
patent: 6444548 (2002-09-01), Divakaruni et al.
patent: 8-17938 (1996-01-01), None
patent: 9-232444 (1997-09-01), None
patent: 10-294443 (1998-11-01), None
patent: 2000-252445 (2000-09-01), None
patent: 2000-357779 (2000-12-01), None
patent: 2002-83941 (2002-03-01), None

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