Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

2005-09-20

2005-09-20

Eckert, George (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S779000, C257S780000, C438S108000, C438S613000

Reexamination Certificate

active

06946741

ABSTRACT:
A semiconductor device is provided which includes a first semiconductor chip, a substrate onto which the first semiconductor chip is flip-chip bonded and on which a concave is formed along one side of the first semiconductor chip which is flip-chip bonded, a second semiconductor chip which is flip-chip bonded onto a portion on the substrate opposite the first semiconductor chip across the concave on the substrate, and a resin applied to spaces between the substrate and the first and second semiconductor chips.

REFERENCES:
patent: 5710071 (1998-01-01), Beddingfield et al.
patent: 6090301 (2000-07-01), Mizukoshi et al.
patent: 6300685 (2001-10-01), Hasegawa et al.
patent: 6404062 (2002-06-01), Taniguchi et al.
patent: 6507098 (2003-01-01), Lo et al.
patent: 6770543 (2004-08-01), Nakamura
patent: A 63-124425 (1988-05-01), None
patent: 05175361 (1993-07-01), None
patent: 2000-003922 (2000-01-01), None
patent: A 2002-208670 (2002-07-01), None

Affiliated with

Also associated with

Rating

Semiconductor device and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3399119